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Optocap Turn-Key Assembly Platform for Fiber Coupled Devices
Optocap Ltd. a leading provider of advanced packaging and assembly services for Optoelectronic and Microelectronic products has announced the release of its “Turn-Key Packaging Platform” for fiber coupling of Optoelectronic devices. This new platform utilises Optocap’s proprietary designs, materials and process know-how to provide a cost-effective, reliable and flexible solution for both prototype and volume quantities.
Optocap’s standard platform provides several key benefits:
- Avoids Design and Development NRE charges;
- Utilises Telcordia/Space compliant processes and materials;
- Enables faster time to market by utilising off-the-shelf components and avoiding key technical pitfalls;
- Provides competitive unit prices based on automated assembly processes and utilising economies of scales for purchasing materials;
- Flexibility for solutions from visible to terahertz wavelengths.
Optocap’s standard platform has the following features:
- Wide range of packages including 14-pin butterfly packages and TO-cans;
- PM, SM, MM, Polycrystalline, High temperature fibres and FVA’s including lensed options;
- High quality AR coating with variety of lens designs to maximise coupling efficiency;
- Solutions for a wide range of devices and wavelengths including DFB, DBR lasers, SOA’s, SLD’s VCSEL’s, Photodiodes and Quantum Cascade lasers;
- Isolators and Free-Space optics;
- Thermistor, TEC and Monitor Photodiode.
“Optocap has been investing in the building blocks of our turn-key fiber assembly platforms over a number of years and we are pleased to bring this technology to market. This platform has already demonstrated significant cost, delivery and performance advantages for a large base of customers in multiple technology sectors” said Stephen Duffy, Director of Sales and Marketing at Optocap Ltd.
About Optocap:
Optocap Limited is a sub contract manufacturing, design & engineering service provider for packaging and assembly in the Microelectronics and Optoelectronics industry. Optocap's expertise in packaging and assembly solutions spans the development process: from design through prototyping, qualification, failure analysis and volume manufacture.
For further information:
CONTACT:
Stephen Duffy, Director of Sales & Marketing, Optocap Ltd.
Stephen.duffy@optocap.com
OR:
Andrew Thompson, Technical Sales Manager, Optocap Ltd.
Andrew.thompson@optocap.com
Optocap Limited,
5 Bain Square,
Livingston,
EH54 7DQ,
UK.
Tel: +44(0)1506 403550
Fax: +44(0)1506 403551
Email: info@optocap.com
Web: http://www.optocap.com