Organisation Description

Raytheon semiconductors offers CMOS mixed signal ASICS and specialist wafer processing services. We offer CMOS IC design and manufacture for experienced and start up customers and have extensive experience supporting customers in the start up and in cubation phases. We offer: Design,wafer fabrication, test, assembly and qualification capabilities. Support in supply chain/materials procurement activities. Support in transitioning manufacturing to non RSL locations (if applicable). Contract wafers processing services, such as ion implant. Vertical integration with our co-located RSL Hybrid and CCA (Circuit Card Assembly) facilities. Product Analysis Services.
A subsiduary of Raytheon Co.

Product/Research Description

Mixed signal ASIC’s: Full custom mixed-signal Application Specific Integrated Circuits (ASIC), with non-volatile memory, to a range of industrial, automotive and military customers. Integrated photodiodes. Very long product li fecycle supply. Specialist Wafer Processing Services: Wafer foundry services, including specialised processed on silicon and on non-silicon substrates. – Comprehensive product support from initial idea to production. – Range of CMOS a nd PiN photodiode processes available. – Process development and process transfer expertise for customer processes. – Subcontract test. – Individual process step service such as ion implant, wafer saw, wafer probe.

New Products

Recent work has included the integration of photodiodes into out mixed signal CMOS processes, Silicon Carbide process step development and wafer processing services and participation in a joint programme to integrate Compound Semiconductors with CMOS on silicon wafers.

Quality Standards

ISO/TS16949:2002/ AS 9100/ ISO 14001/ BS EN ISO 9001:2000

Main Markets

Our mixed signal ASICs are used in a wide variety of applications including Automotive and Transportation Safety such as MEMS accelermeter interfaces and Automatic train protection, Industrial Safety such as Fire/smoke detection. Personnel Security such as Secure RFID transponders, Access control tags/cards and Secure pre-payment keys and Defense Electronics. Many of these applications involve sensor interface devices. Most of our customer are UK or European based but we also have custom ers in the USA, Japan and South Africa.

Services Offered

Design and manufacturing services, please see above.

Specialised Skills and Facilities

Raytheon System Limited’s Semiconductor Business Area has long standing experience in the design and manufacture of CMOS based signal conditioning solutions for numerous sensor applications. Designs are executed using our Mentor CAD tool set. Utilising a flexible fab approach, the business also has significant development experience of its own semiconductor processes and in the transfer of customer owned processes into the company’s Glenrothes wafer fabrication facility. The semiconductor bus iness area operates a flexible fab approach with process developments taking place alongside existing production processes. This allows new processes to be developed in-situ with the main production toolset.

Collaboration Sought or Offered

RSL is looking for new customers to make use of our capabilities. We work flexibly and can support any entry point into the ASIC development process required, from functional description through printed schematics, VHDL netlists to GDS layout data f or customer owned tooling business. We can supply devices in any required format from un-sawn wafers through tested dice on film to fully packaged, tested and qualified devices. We are also interested in finding new customers for our wafer fou ndry and wafer processing services. In particular we are willing to support early stage companies with low volume requirements.